Insulation Protection: The heatsink cooling pad has good insulation and will not cause any kind of damage when touching any electrical traces
Thermal Conductivity: The heatsink cooling pad can effectively dissipate heat in real time for applicable accessories, with a thermal conductivity of 15W/mK
Heat Resistance: The thermal compound pad is harmless, odorless, with heat resistance, which will not damage in the range of ‑40°C to 200°C
Antistatic Performance : The thermal compound pad has corrosion resistance, abrasion resistance, antistatic and flame retardant properties and can be used with confidence
Scope of Application: The thermal pad is suitable for electronic products, CPU, GPU, power LED, computer mainframe, laptop, desktop and any cooling module